Chip Quik Inc. TS391LT

Chip Quik Inc. TS391LT electronic component

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Manufacturer
Manufacturer No
TS391LT
Packaging
Bulk
Description
THERMALLY STABLE SOLDER PASTE NO
Detailed Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.53 oz (15g), 5cc
DataSheet
Form
Syringe, 0.53 oz (15g), 5cc
Type
Solder Paste
Process
Lead Free
Flux Type
No-Clean
Mesh Type
4
Packaging
Bulk
Shelf Life
12 Months
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Part Status
Active
Manufacturer
Chip Quik Inc.
Melting Point
281°F (138°C)
Shelf Life Start
Date of Manufacture
Base Product Number
TS391L
Storage/Refrigeration Temperature
68°F ~ 77°F (20°C ~ 25°C)
AttributeValue
FormSyringe, 0.53 oz (15g), 5cc
TypeSolder Paste
ProcessLead Free
Flux TypeNo-Clean
Mesh Type4
PackagingBulk
Shelf Life12 Months
CompositionBi57.6Sn42Ag0.4 (57.6/42/0.4)
Part StatusActive
ManufacturerChip Quik Inc.
Melting Point281°F (138°C)
Shelf Life StartDate of Manufacture
Base Product NumberTS391L
Storage/Refrigeration Temperature68°F ~ 77°F (20°C ~ 25°C)

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

Processing Time: Shipping fees vary depending on the destination region and country.