Step1: Product
Chip Quik Inc. SMD291SNL40T7
Image shown is a representation only
Manufacturer
Manufacturer No
SMD291SNL40T7
Packaging
Bulk
Description
SOLDER PASTE IN JAR 40G (T7) SAC
Detailed Description
No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.41 oz (40g)
Datasheet
Form
Jar, 1.41 oz (40g)
Type
Solder Paste
Flux Type
No-Clean
Mesh Type
7
Packaging
Bulk
Shelf Life
6 Months
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Manufacturer
Chip Quik Inc.
Melting Point
423 ~ 428°F (217 ~ 220°C)
Shelf Life Start
Date of Manufacture
Base Product Number
SMD291
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
| Attribute | Value |
|---|---|
| Form | Jar, 1.41 oz (40g) |
| Type | Solder Paste |
| Flux Type | No-Clean |
| Mesh Type | 7 |
| Packaging | Bulk |
| Shelf Life | 6 Months |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Manufacturer | Chip Quik Inc. |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) |
| Shelf Life Start | Date of Manufacture |
| Base Product Number | SMD291 |
| Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
Purchase & Inquiry
Placing an Order
You may place an order on DAXIN without creating an account.
Available Payment Methods
For your convenience, we accept several payment methods in USD, including PayPal, credit card, and wire transfer.
RFQ (Request for Quote)
We recommend submitting an RFQ to receive the latest pricing and inventory information for the parts you need.
Our sales team will respond to your request by email within 24 hours.
Important Notes
1. You will receive an order information email in your inbox. Please check your spam folder if you do not find the email.
2. Since inventory and pricing may change from time to time, our sales manager will reconfirm your order and notify you if any updates are needed.
Payment Method
Shipping Method
- Shipped from
- Hongkong/Shenzhen warehouse
- Estimated Ship Date
- Oct 4, 2026 - Oct 5, 2026
- Lead Time
- Contact us to confirm availability
- Shipping Fee
- Calculated based on your destination
Packages
