CEVA Technologies, Inc. FSP200 DEVELOPMENT KIT

CEVA Technologies, Inc. FSP200 DEVELOPMENT KIT electronic component

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Manufacturer No
FSP200 DEVELOPMENT KIT
Packaging
Bulk
Description
FSP200 DEVELOPMENT KIT
Detailed Description
BMI055, FSP200 Accelerometer, Gyroscope Sensor Nucleo Platform Evaluation Expansion Board
DataSheet
Type
Sensor
Contents
Board(s)
Function
Accelerometer, Gyroscope
Platform
Nucleo
Packaging
Bulk
Part Status
Obsolete
Manufacturer
CEVA Technologies, Inc.
Utilized IC / Part
BMI055, FSP200
AttributeValue
TypeSensor
ContentsBoard(s)
FunctionAccelerometer, Gyroscope
PlatformNucleo
PackagingBulk
Part StatusObsolete
ManufacturerCEVA Technologies, Inc.
Utilized IC / PartBMI055, FSP200

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Packing

Product before packing
Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-StaticBag
Individual packaging box
Step4: Individual Packaging
Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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