Broadcom Limited BCM53575B0IFSBG

Broadcom Limited BCM53575B0IFSBG electronic component

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Manufacturer
Manufacturer No
BCM53575B0IFSBG
Packaging
Tray
Description
24X1G + 4X10G L2 TSN SWITCH
Detailed Description
ARM® Cortex®-A9, ARM® Cortex®-R5 System On Chip (SOC) IC - 1.25GHz
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Speed
1.25GHz
Packaging
Tray
Peripherals
SERDES
Architecture
MPU
Connectivity
ACL, MAC, QSGMII
Manufacturer
Broadcom Limited
Core Processor
ARM® Cortex®-A9, ARM® Cortex®-R5
AttributeValue
Speed1.25GHz
PackagingTray
PeripheralsSERDES
ArchitectureMPU
ConnectivityACL, MAC, QSGMII
ManufacturerBroadcom Limited
Core ProcessorARM® Cortex®-A9, ARM® Cortex®-R5

Purchase & Inquiry

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Available Payment Methods

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RFQ (Request for Quote)

We recommend submitting an RFQ to receive the latest pricing and inventory information for the parts you need.

Our sales team will respond to your request by email within 24 hours.

Important Notes

1. You will receive an order information email in your inbox. Please check your spam folder if you do not find the email.

2. Since inventory and pricing may change from time to time, our sales manager will reconfirm your order and notify you if any updates are needed.

Payment Method

Transaction fee is charged according to bank/payment system rules.

Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 3, 2026 - Oct 4, 2026
Shipping Fee
Calculated based on your destination

Packages

Product before packing

Step1: Product

Product in anti-static bag

Step2: Anti StaticBag

Product in individual packaging

Step3: Individual Packaging

Individual packaging box

Step4: Packaging Boxes

Packaging box with shipping label

Step5: Bar-Code Shipping Tags

Shipping by cargo vessel

Step6: Shipping