AMD XCZU9CG-1FFVC900E

AMD XCZU9CG-1FFVC900E electronic component

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Manufacturer
Manufacturer No
XCZU9CG-1FFVC900E
Package
900-BBGA, FCBGA
Packaging
Tray
Description
IC SOC CORTEX-A53 900FCBGA
Detailed Description
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSOC CG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)
Datasheet
ISO 13485 certification
ISO 14001 certification
Five-Star Service certification
UKAS management certification
IAF recognition arrangement certification
Speed
500MHz, 1.2GHz
Series
Zynq® UltraScale+™ MPSOC CG
RAM Size
256KB
Packaging
Tray
Peripherals
DMA, WDT
Architecture
MCU, FPGA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Manufacturer
AMD
Number of I/O
204
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Package / Case
900-BBGA, FCBGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Base Product Number
XCZU9
Operating Temperature
0°C ~ 100°C (TJ)
Supplier Device Package
900-FCBGA (31x31)
AttributeValue
Speed500MHz, 1.2GHz
SeriesZynq® UltraScale+™ MPSOC CG
RAM Size256KB
PackagingTray
PeripheralsDMA, WDT
ArchitectureMCU, FPGA
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
ManufacturerAMD
Number of I/O204
Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Package / Case900-BBGA, FCBGA
Primary AttributesZynq®UltraScale+™ FPGA, 599K+ Logic Cells
Base Product NumberXCZU9
Operating Temperature0°C ~ 100°C (TJ)
Supplier Device Package900-FCBGA (31x31)

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Shipping Method

Shipped from
Hongkong/Shenzhen warehouse
Estimated Ship Date
Oct 3, 2026 - Oct 4, 2026
Shipping Fee
Calculated based on your destination

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