AMD XCZU7CG-1FFVC1156I

AMD XCZU7CG-1FFVC1156I electronic component

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Manufacturer
Manufacturer No
XCZU7CG-1FFVC1156I
Package
1156-BBGA, FCBGA
Packaging
Tray
Description
IC SOC CORTEX-A53 1156FCBGA
Detailed Description
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSOC CG Zynq®UltraScale+™ FPGA, 504K+ Logic Cells 500MHz, 1.2GHz 1156-FCBGA (35x35)
DataSheet
Speed
500MHz, 1.2GHz
Series
Zynq® UltraScale+™ MPSOC CG
RAM Size
256KB
Packaging
Tray
Part Status
Active
Peripherals
DMA, WDT
Architecture
MCU, FPGA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Manufacturer
AMD
Number of I/O
360
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Package / Case
1156-BBGA, FCBGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Base Product Number
XCZU7
Operating Temperature
-40°C ~ 100°C (TJ)
Supplier Device Package
1156-FCBGA (35x35)
AttributeValue
Speed500MHz, 1.2GHz
SeriesZynq® UltraScale+™ MPSOC CG
RAM Size256KB
PackagingTray
Part StatusActive
PeripheralsDMA, WDT
ArchitectureMCU, FPGA
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
ManufacturerAMD
Number of I/O360
Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Package / Case1156-BBGA, FCBGA
Primary AttributesZynq®UltraScale+™ FPGA, 504K+ Logic Cells
Base Product NumberXCZU7
Operating Temperature-40°C ~ 100°C (TJ)
Supplier Device Package1156-FCBGA (35x35)

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Packing

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Step1: Product
Vacuum packaged product
Step2: Vacuum Packaging
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Step3: Anti-StaticBag
Individual packaging box
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Packaging boxes
Step5: Packaging Boxes

Shipping Information

Shipping TypeShip FeeLead Time
DHLDHL$20.00-$40.00 (0.50 KG)2-5 days
FedExFedex$20.00-$40.00 (0.50 KG)2-5 days
UPSUPS$20.00-$40.00 (0.50 KG)2-5 days
EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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