AMD XCZU11EG-3FFVC1156E

AMD XCZU11EG-3FFVC1156E electronic component

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Manufacturer
Manufacturer No
XCZU11EG-3FFVC1156E
Package
1156-BBGA, FCBGA
Packaging
Tray
Description
IC SOC CORTEX-A53 1156FCBGA
Detailed Description
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSOC EG Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 600MHz, 667MHz, 1.5GHz 1156-FCBGA (35x35)
DataSheet
Speed
600MHz, 667MHz, 1.5GHz
Series
Zynq® UltraScale+™ MPSOC EG
RAM Size
256KB
Packaging
Tray
Part Status
Active
Peripherals
DMA, WDT
Architecture
MCU, FPGA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Manufacturer
AMD
Number of I/O
360
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Package / Case
1156-BBGA, FCBGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Base Product Number
XCZU11
Operating Temperature
0°C ~ 100°C (TJ)
Supplier Device Package
1156-FCBGA (35x35)
AttributeValue
Speed600MHz, 667MHz, 1.5GHz
SeriesZynq® UltraScale+™ MPSOC EG
RAM Size256KB
PackagingTray
Part StatusActive
PeripheralsDMA, WDT
ArchitectureMCU, FPGA
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
ManufacturerAMD
Number of I/O360
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Package / Case1156-BBGA, FCBGA
Primary AttributesZynq®UltraScale+™ FPGA, 653K+ Logic Cells
Base Product NumberXCZU11
Operating Temperature0°C ~ 100°C (TJ)
Supplier Device Package1156-FCBGA (35x35)

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EMSEMS$20.00-$40.00 (0.50 KG)2-5 days

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