Step1: Product
AMD XA7Z030-1FBG484I
Image shown is a representation only
Manufacturer
Manufacturer No
XA7Z030-1FBG484I
Package
484-BBGA, FCBGA
Packaging
Tray
Description
IC SOC CORTEX-A9 667MHZ 484FCBGA
Detailed Description
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 XA Kintex™-7 FPGA, 125K Logic Cells 667MHz 484-FCBGA (23x23)
DataSheet
Grade
Automotive
Speed
667MHz
Series
Zynq®-7000 XA
RAM Size
256KB
Packaging
Tray
Part Status
Obsolete
Peripherals
DMA
Architecture
MCU, FPGA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Manufacturer
AMD
Number of I/O
130
Qualification
AEC-Q100
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Package / Case
484-BBGA, FCBGA
Primary Attributes
Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature
-40°C ~ 100°C (TJ)
Supplier Device Package
484-FCBGA (23x23)
| Attribute | Value |
|---|---|
| Grade | Automotive |
| Speed | 667MHz |
| Series | Zynq®-7000 XA |
| RAM Size | 256KB |
| Packaging | Tray |
| Part Status | Obsolete |
| Peripherals | DMA |
| Architecture | MCU, FPGA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Manufacturer | AMD |
| Number of I/O | 130 |
| Qualification | AEC-Q100 |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Package / Case | 484-BBGA, FCBGA |
| Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 484-FCBGA (23x23) |
Purchase & Inquiry
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Packing
Step2: Vacuum Packaging
Step3: Anti-StaticBag
Step4: Individual Packaging
Step5: Packaging Boxes
Shipping Information
| Shipping Type | Ship Fee | Lead Time | |
|---|---|---|---|
 | DHL | $20.00-$40.00 (0.50 KG) | 2-5 days |
 | Fedex | $20.00-$40.00 (0.50 KG) | 2-5 days |
 | UPS | $20.00-$40.00 (0.50 KG) | 2-5 days |
 | EMS | $20.00-$40.00 (0.50 KG) | 2-5 days |
Processing Time: Shipping fees vary depending on the destination region and country.
